{"filing":{"accession_number":"0001437749-26-022141","cik":"0000855658","ticker":"LSCC","company_name":"LATTICE SEMICONDUCTOR CORP","form":"8-K","filing_date":"2026-06-30","report_date":null,"primary_document":"lscc20260629_8k.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/855658/000143774926022141/lscc20260629_8k.htm"},"events":[{"id":15125,"run_id":13492,"accession_number":"0001437749-26-022141","anchor_item_number":"1.01","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.92,"summary":"Lattice Semiconductor entered into a Second Amended and Restated Credit Agreement on June 30, 2026, establishing a $200 million senior secured revolving loan facility and a $950 million senior secured delayed draw term loan facility, totaling $1.15 billion in new direct financial obligations. The delayed draw term loans are designated to finance the AMI acquisition.","company_name":"LATTICE SEMICONDUCTOR CORP","ticker":"LSCC","filing_date":"2026-06-30","form":"8-K","submitted_at":null,"items":[{"id":12771,"accession_number":"0001437749-26-022141","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"Lattice Semiconductor entered into a Second Amended and Restated Credit Agreement on June 30, 2026, establishing a $200 million senior secured revolving loan facility and a $950 million senior secured delayed draw term loan facility. This represents the creation of new direct financial obligations totaling $1.15 billion, which is material to the registrant and would affect a reasonable investor's assessment of the company's capital structure and financial position. The delayed draw term loans are specifically designated to finance the AMI acquisition.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-01T02:31:00.143059+00:00","company_name":"","ticker":null,"filing_date":""},{"id":12772,"accession_number":"0001437749-26-022141","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an Off-Balance Sheet Arrangement of a Registrant.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.85,"reasoning":"Item 2.03 explicitly addresses creation of a direct financial obligation. The filing incorporates Item 1.01 by reference, which typically covers material acquisitions, dispositions, or related financing arrangements. The disclosure of a new direct financial obligation in this Item signals a debt issuance or credit facility arrangement, which is material to investors assessing the registrant's capital structure and financial obligations.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-01T02:31:00.143059+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":12771,"accession_number":"0001437749-26-022141","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"Lattice Semiconductor entered into a Second Amended and Restated Credit Agreement on June 30, 2026, establishing a $200 million senior secured revolving loan facility and a $950 million senior secured delayed draw term loan facility. This represents the creation of new direct financial obligations totaling $1.15 billion, which is material to the registrant and would affect a reasonable investor's assessment of the company's capital structure and financial position. The delayed draw term loans are specifically designated to finance the AMI acquisition.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-01T02:31:00.143059+00:00","company_name":"LATTICE SEMICONDUCTOR CORP","ticker":"LSCC","filing_date":"2026-06-30"},{"id":12772,"accession_number":"0001437749-26-022141","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an Off-Balance Sheet Arrangement of a Registrant.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.85,"reasoning":"Item 2.03 explicitly addresses creation of a direct financial obligation. The filing incorporates Item 1.01 by reference, which typically covers material acquisitions, dispositions, or related financing arrangements. The disclosure of a new direct financial obligation in this Item signals a debt issuance or credit facility arrangement, which is material to investors assessing the registrant's capital structure and financial obligations.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-01T02:31:00.143059+00:00","company_name":"LATTICE SEMICONDUCTOR CORP","ticker":"LSCC","filing_date":"2026-06-30"}]}