{"filing":{"accession_number":"0001413447-26-000051","cik":"0001413447","ticker":"NXPI","company_name":"NXP Semiconductors N.V.","form":"8-K","filing_date":"2026-09-02","report_date":"2026-09-01","primary_document":"nxpi-20260901.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/1413447/000141344726000051/nxpi-20260901.htm"},"events":[{"id":31276,"run_id":28691,"accession_number":"0001413447-26-000051","anchor_item_number":"1.01","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.94,"summary":"NXP B.V. entered into a $250 million unsecured senior loan facility agreement with the European Investment Bank on September 1, 2026, creating a new direct financial obligation with a six-year maximum tenor, guaranteed by the parent company and subsidiaries, to fund capital expansion of semiconductor manufacturing capacity in Malaysia.","company_name":"NXP Semiconductors N.V.","ticker":"NXPI","filing_date":"2026-09-02","form":"8-K","submitted_at":null,"items":[{"id":34107,"accession_number":"0001413447-26-000051","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"NXP B.V. entered into a $250 million unsecured senior loan facility agreement with the European Investment Bank on September 1, 2026. This creates a new direct financial obligation with a six-year maximum tenor, guaranteed by the parent company and subsidiaries. The facility is a material debt issuance used to fund capital expansion of semiconductor manufacturing capacity in Malaysia.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-09-02T20:05:03.495396+00:00","company_name":"","ticker":null,"filing_date":""},{"id":34108,"accession_number":"0001413447-26-000051","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an off-Balance Sheet Arrangement of a Registrant","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.92,"reasoning":"Item 2.03 explicitly addresses \"Creation of a Direct Financial Obligation,\" and the disclosure incorporates by reference a Facility Agreement and Guaranty from Item 1.01, indicating NXP has entered into a new credit facility or debt arrangement. The forward-looking statements reference \"borrowings under the Facility Agreement\" and \"a potential second facility agreement,\" confirming the creation of new direct financial obligations. This is a material debt issuance event typical of Item 2.03 disclosures.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-09-02T20:05:03.495396+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":34107,"accession_number":"0001413447-26-000051","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"NXP B.V. entered into a $250 million unsecured senior loan facility agreement with the European Investment Bank on September 1, 2026. This creates a new direct financial obligation with a six-year maximum tenor, guaranteed by the parent company and subsidiaries. The facility is a material debt issuance used to fund capital expansion of semiconductor manufacturing capacity in Malaysia.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-09-02T20:05:03.495396+00:00","company_name":"NXP Semiconductors N.V.","ticker":"NXPI","filing_date":"2026-09-02"},{"id":34108,"accession_number":"0001413447-26-000051","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an off-Balance Sheet Arrangement of a Registrant","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.92,"reasoning":"Item 2.03 explicitly addresses \"Creation of a Direct Financial Obligation,\" and the disclosure incorporates by reference a Facility Agreement and Guaranty from Item 1.01, indicating NXP has entered into a new credit facility or debt arrangement. The forward-looking statements reference \"borrowings under the Facility Agreement\" and \"a potential second facility agreement,\" confirming the creation of new direct financial obligations. This is a material debt issuance event typical of Item 2.03 disclosures.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-09-02T20:05:03.495396+00:00","company_name":"NXP Semiconductors N.V.","ticker":"NXPI","filing_date":"2026-09-02"}]}