{"filing":{"accession_number":"0001213900-26-071530","cik":"0001740332","ticker":"REZI","company_name":"RESIDEO TECHNOLOGIES, INC.","form":"8-K","filing_date":"2026-06-24","report_date":null,"primary_document":"ea0295571-8k_resideo.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/1740332/000121390026071530/ea0295571-8k_resideo.htm"},"events":[{"id":13562,"run_id":12051,"accession_number":"0001213900-26-071530","anchor_item_number":"1.01","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.75,"summary":"The primary Item 1.01 disclosure describes a subsidiary merger in which Resideo Funding II LLC assumed the obligations of Resideo Funding Inc.'s outstanding 4.000% Senior Notes due 2029 and 6.500% Senior Notes due 2032, along with credit agreement obligations. While this is technically a restructuring of existing debt obligations rather than issuance of new debt, the assumption of material debt obligations and entry into supplemental indentures and credit agreement amendments constitute a material modification of the registrant's direct financial obligations. The Item 8.01 disclosure of a $11.6 million cash payment to Honeywell is a separate material event but secondary to the debt restructuring.","company_name":"RESIDEO TECHNOLOGIES, INC.","ticker":"REZI","filing_date":"2026-06-24","form":"8-K","submitted_at":null,"items":[{"id":10734,"accession_number":"0001213900-26-071530","item_number":"1.01","item_title":"Entry into a Material Definitive","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.75,"reasoning":"The primary Item 1.01 disclosure describes a subsidiary merger in which Resideo Funding II LLC assumed the obligations of Resideo Funding Inc.'s outstanding 4.000% Senior Notes due 2029 and 6.500% Senior Notes due 2032, along with credit agreement obligations. While this is technically a restructuring of existing debt obligations rather than issuance of new debt, the assumption of material debt obligations and entry into supplemental indentures and credit agreement amendments constitute a material modification of the registrant's direct financial obligations. The Item 8.01 disclosure of a $11.6 million cash payment to Honeywell is a separate material event but secondary to the debt restructuring.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-06-24T20:44:37.150098+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":10734,"accession_number":"0001213900-26-071530","item_number":"1.01","item_title":"Entry into a Material Definitive","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.75,"reasoning":"The primary Item 1.01 disclosure describes a subsidiary merger in which Resideo Funding II LLC assumed the obligations of Resideo Funding Inc.'s outstanding 4.000% Senior Notes due 2029 and 6.500% Senior Notes due 2032, along with credit agreement obligations. While this is technically a restructuring of existing debt obligations rather than issuance of new debt, the assumption of material debt obligations and entry into supplemental indentures and credit agreement amendments constitute a material modification of the registrant's direct financial obligations. The Item 8.01 disclosure of a $11.6 million cash payment to Honeywell is a separate material event but secondary to the debt restructuring.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-06-24T20:44:37.150098+00:00","company_name":"RESIDEO TECHNOLOGIES, INC.","ticker":"REZI","filing_date":"2026-06-24"}]}