{"filing":{"accession_number":"0001193125-26-365826","cik":"0001033767","ticker":"UMC","company_name":"UNITED MICROELECTRONICS CORP","form":"6-K","filing_date":"2026-08-26","report_date":"2026-08-26","primary_document":"6k_on_08262026.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526365826/6k_on_08262026.htm"},"events":[{"id":29600,"run_id":27113,"accession_number":"0001193125-26-365826","anchor_item_number":"EX-99.1","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"summary":"The Board of Directors resolved to issue up to US$1.8 billion in 7th Unsecured Overseas Convertible Bonds. This is a material creation of a new direct financial obligation. Although the bonds are convertible into shares, the primary disclosure is the debt issuance itself—a significant capital-raising event that would materially affect a reasonable investor's assessment of UMC's capital structure and financial obligations.","company_name":"UNITED MICROELECTRONICS CORP","ticker":"UMC","filing_date":"2026-08-26","form":"6-K","submitted_at":null,"items":[{"id":31931,"accession_number":"0001193125-26-365826","item_number":"EX-99.1","item_title":"umc-ex99_1.htm","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"The Board of Directors resolved to issue up to US$1.8 billion in 7th Unsecured Overseas Convertible Bonds. This is a material creation of a new direct financial obligation. Although the bonds are convertible into shares, the primary disclosure is the debt issuance itself—a significant capital-raising event that would materially affect a reasonable investor's assessment of UMC's capital structure and financial obligations.","classifier_version":"claude-haiku-4-5-20251001+prompt-6be895f9","taxonomy_version":"v1.3","classified_at":"2026-08-26T10:20:49.316390+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":31931,"accession_number":"0001193125-26-365826","item_number":"EX-99.1","item_title":"umc-ex99_1.htm","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"The Board of Directors resolved to issue up to US$1.8 billion in 7th Unsecured Overseas Convertible Bonds. This is a material creation of a new direct financial obligation. Although the bonds are convertible into shares, the primary disclosure is the debt issuance itself—a significant capital-raising event that would materially affect a reasonable investor's assessment of UMC's capital structure and financial obligations.","classifier_version":"claude-haiku-4-5-20251001+prompt-6be895f9","taxonomy_version":"v1.3","classified_at":"2026-08-26T10:20:49.316390+00:00","company_name":"UNITED MICROELECTRONICS CORP","ticker":"UMC","filing_date":"2026-08-26"}]}