{"filing":{"accession_number":"0001193125-26-333718","cik":"0001033767","ticker":"UMC","company_name":"UNITED MICROELECTRONICS CORP","form":"6-K","filing_date":"2026-08-05","report_date":"2026-08-05","primary_document":"6k_on_08052026.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526333718/6k_on_08052026.htm"},"events":[{"id":24456,"run_id":22162,"accession_number":"0001193125-26-333718","anchor_item_number":"EX-99.1","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"summary":"UMC announced completion of proceeds collection for its 1st domestic unsecured convertible corporate bond issuance totaling NT$12.12 billion. This represents creation of a new direct financial obligation through debt issuance. The convertible bond structure and material size (NT$12.12 billion) make this a significant capital-raising event that would affect investor assessment of the company's capital structure and financial position.","company_name":"UNITED MICROELECTRONICS CORP","ticker":"UMC","filing_date":"2026-08-05","form":"6-K","submitted_at":null,"items":[{"id":25012,"accession_number":"0001193125-26-333718","item_number":"EX-99.1","item_title":"umc-ex99_1.htm","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"UMC announced completion of proceeds collection for its 1st domestic unsecured convertible corporate bond issuance totaling NT$12.12 billion. This represents creation of a new direct financial obligation through debt issuance. The convertible bond structure and material size (NT$12.12 billion) make this a significant capital-raising event that would affect investor assessment of the company's capital structure and financial position.","classifier_version":"claude-haiku-4-5-20251001+prompt-6be895f9","taxonomy_version":"v1.3","classified_at":"2026-08-06T02:37:11.648114+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":25012,"accession_number":"0001193125-26-333718","item_number":"EX-99.1","item_title":"umc-ex99_1.htm","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"UMC announced completion of proceeds collection for its 1st domestic unsecured convertible corporate bond issuance totaling NT$12.12 billion. This represents creation of a new direct financial obligation through debt issuance. The convertible bond structure and material size (NT$12.12 billion) make this a significant capital-raising event that would affect investor assessment of the company's capital structure and financial position.","classifier_version":"claude-haiku-4-5-20251001+prompt-6be895f9","taxonomy_version":"v1.3","classified_at":"2026-08-06T02:37:11.648114+00:00","company_name":"UNITED MICROELECTRONICS CORP","ticker":"UMC","filing_date":"2026-08-05"}]}