{"filing":{"accession_number":"0000947871-26-000630","cik":"0000932787","ticker":"STMEF","company_name":"STMicroelectronics N.V.","form":"6-K","filing_date":"2026-06-16","report_date":null,"primary_document":"ss6463904_6k.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/932787/000094787126000630/ss6463904_6k.htm"},"events":[{"id":12300,"run_id":10866,"accession_number":"0000947871-26-000630","anchor_item_number":null,"event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"summary":"STMicroelectronics announces a US$1.5 billion dual-tranche offering of convertible bonds (2031 and 2033 tranches) and the early redemption of its 2027 Convertible Bonds. This is a material creation of new direct financial obligations through debt issuance, approved by both the managing board and supervisory board, with settlement expected June 23, 2026. The offering proceeds will be used for general corporate purposes including redemption of existing debt.","company_name":"STMicroelectronics N.V.","ticker":"STMEF","filing_date":"2026-06-16","form":"6-K","submitted_at":null,"items":null}],"classifications":[{"id":9114,"accession_number":"0000947871-26-000630","item_number":null,"item_title":null,"event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"STMicroelectronics announces a US$1.5 billion dual-tranche offering of convertible bonds (2031 and 2033 tranches) and the early redemption of its 2027 Convertible Bonds. This is a material creation of new direct financial obligations through debt issuance, approved by both the managing board and supervisory board, with settlement expected June 23, 2026. The offering proceeds will be used for general corporate purposes including redemption of existing debt.","classifier_version":"claude-haiku-4-5-20251001+prompt-6be895f9","taxonomy_version":"v1.3","classified_at":"2026-06-22T02:35:20.720268+00:00","company_name":"STMicroelectronics N.V.","ticker":"STMEF","filing_date":"2026-06-16"}]}