{"filing":{"accession_number":"0000088941-26-000022","cik":"0000088941","ticker":"SMTC","company_name":"SEMTECH CORP","form":"8-K","filing_date":"2026-07-06","report_date":null,"primary_document":"smtc-20260706.htm","primary_document_url":"https://www.sec.gov/Archives/edgar/data/88941/000008894126000022/smtc-20260706.htm"},"events":[{"id":16239,"run_id":14490,"accession_number":"0000088941-26-000022","anchor_item_number":"1.01","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.94,"summary":"Semtech entered into a new $360 million revolving credit facility and uncommitted incremental term loan facility with Morgan Stanley Senior Funding as administrative agent on July 6, 2026, refinancing and replacing the prior JPMorgan Chase credit agreement.","company_name":"SEMTECH CORP","ticker":"SMTC","filing_date":"2026-07-06","form":"8-K","submitted_at":null,"items":[{"id":14279,"accession_number":"0000088941-26-000022","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"Semtech entered into a new Credit Agreement on July 6, 2026, establishing a $360 million revolving credit facility and an uncommitted incremental term loan facility with Morgan Stanley Senior Funding as administrative agent. This represents the creation of a new direct financial obligation and refinancing of existing indebtedness (the prior JPMorgan Chase credit agreement was terminated and paid in full concurrently). The disclosure of material debt facility terms, covenants, and security arrangements is characteristic of debt_issuance classification.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-07T18:56:28.223386+00:00","company_name":"","ticker":null,"filing_date":""},{"id":14280,"accession_number":"0000088941-26-000022","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an Off- Balance Sheet Arrangement of a Registrant.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.92,"reasoning":"Item 2.03 discloses creation of a direct financial obligation through a Credit Agreement, which is incorporated by reference from Item 1.01. This is a material debt or credit facility arrangement typical of debt issuance disclosures. The reference to a Credit Agreement indicates a new direct financial obligation has been created.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-07T18:56:28.223386+00:00","company_name":"","ticker":null,"filing_date":""}]}],"classifications":[{"id":14279,"accession_number":"0000088941-26-000022","item_number":"1.01","item_title":"Entry into a Material Definitive Agreement.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.95,"reasoning":"Semtech entered into a new Credit Agreement on July 6, 2026, establishing a $360 million revolving credit facility and an uncommitted incremental term loan facility with Morgan Stanley Senior Funding as administrative agent. This represents the creation of a new direct financial obligation and refinancing of existing indebtedness (the prior JPMorgan Chase credit agreement was terminated and paid in full concurrently). The disclosure of material debt facility terms, covenants, and security arrangements is characteristic of debt_issuance classification.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-07T18:56:28.223386+00:00","company_name":"SEMTECH CORP","ticker":"SMTC","filing_date":"2026-07-06"},{"id":14280,"accession_number":"0000088941-26-000022","item_number":"2.03","item_title":"Creation of a Direct Financial Obligation or an Obligation under an Off- Balance Sheet Arrangement of a Registrant.","event_type":"debt_issuance","event_domain":"financial","is_material":true,"confidence":0.92,"reasoning":"Item 2.03 discloses creation of a direct financial obligation through a Credit Agreement, which is incorporated by reference from Item 1.01. This is a material debt or credit facility arrangement typical of debt issuance disclosures. The reference to a Credit Agreement indicates a new direct financial obligation has been created.","classifier_version":"claude-haiku-4-5-20251001+prompt-a85dd512","taxonomy_version":"v1.3","classified_at":"2026-07-07T18:56:28.223386+00:00","company_name":"SEMTECH CORP","ticker":"SMTC","filing_date":"2026-07-06"}]}